| 摘要 |
<p>PROBLEM TO BE SOLVED: To make a camera module thin and light by reducing the number of parts constituting it. SOLUTION: A CCD 24 is mounted on the rear surface of a first semiconductor module 20 with a built-in DSP 32A, etc., which processes an electric signal of the CCD 24. A mount having a lens 23 at the upper part thereof is so mounted as to cover the CCD 24. A second semiconductor module and a rear surface chip part 27 are mounted on the rear surface of the first semiconductor module 20. As a result, a camera module 28 is composed of required minimum components. That is, the camera module 28 is composed without a mounting substrate. Thus, the camera module 28 is made thin and light.</p> |
