| 摘要 |
PROBLEM TO BE SOLVED: To provide a module structure of a high frequency power amplifier capable of downsizing a size without impairing design accuracy of a resonant trap circuit of an output matching circuit. SOLUTION: An input terminal and an output terminal are provided on a first dielectric substrate, and chip parts such as high frequency transistors, capacitors, or inductors and a second dielectric substrate are equipped on the first dielectric substrate. A resonant trap circuit constituted by via holes and capacitors as a part of an output matching circuit is provided on the first dielectric substrate, and a transmission line as a part of the output matching circuit, more specifically, the transmission line composed of a strip line is provided on the second dielectric substrate.
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