| 摘要 |
PROBLEM TO BE SOLVED: To prevent the reduction of imaging sensitivity of a solid-state imaging device due to an adhesive agent. SOLUTION: A reinforcing plate 2 is provide on one surface of a flexible wiring board 1, and a solid-state imaging element 4 is provided on the other surface thereof. The flexible wiring board 1 and reinforcing plate 2 are provided with openings 1b and 2a respectively that form optical paths between the solid- state imaging element 4 and an optical device unit 3. The opening 1b is made smaller in area than the opening 2a, and the inner circumference end surface of the opening 1b is formed inward than that of the opening 2a. An adhesive agent 6 is interposed between the flexible wiring board 1 and solid-state imaging element 4, and the adhesive agent 6 reaches the inner circumference end surface of the opening 1b through its capillary phenomenon. However, the inner circumference end surfaces of the opening 1b and reinforcing plate 2 are not on the same plane, so that the adhesive agent 6 does not reach the reinforcing plate 2. Therefore, the adhesive agent 6 forms a small slope, and it hardly reaches the light reception part 4a of the solid-state imaging element 4.
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