| 摘要 |
PROBLEM TO BE SOLVED: To effectively heat a substrate within a heat treatment apparatus to perform the process accompanied by heating of substrate. SOLUTION: The heat treatment apparatus 1 performs the process accompanied by heating of a substrate 9 through irradiation of light to the substrate 9 within a chamber formed of a body 12 and a window member 13. In this apparatus 1, a plurality of light source units 2 which allocate semiconductor lasers to attain high output power are provided. At the window member 13, a reflecting film is formed in a region except at the region for transmitting the laser beam. Accordingly, effective heating can be executed using a high- power laser output. Moreover, the reflected light from the substrate 9 can be returned to the substrate 9 through reflection by the reflecting film.
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