| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation characteristics of a composite lead frame on which a wiring board is provided. SOLUTION: The composite lead frame comprises a lead frame where an opening of a prescribed shape is made on a conductive plate to provide a die pad to mount an outer lead and a semiconductor chip, and a wiring board where a conductor wiring (inner lead) is provided on one main surface of an insulating board. The wiring board is bonded to the lead frame, while the conductor wiring is electrically connected to the outer lead. Related to the wiring board, an opening is made in the region overlapping, in plan view, with the region of the die pad where the semiconductor chip is mounted, with the tip of the outer lead bonded to the outer peripheral part of the die pad.
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