| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing equipment which can detect whether a slip is generated on a semiconductor wafer, when a semiconductor wafer is cleaned by rotating and driving the wafer. SOLUTION: In processing equipment of a substrate, a plate surface of the semiconductor wafer 11 is processed by using processing solution while the semiconductor wafer 11 is rotated in the circumferential direction. The processing equipment is provided with a roller 7 which rotates and drives the semiconductor wafer in which notches are formed on the outer peripheral surface, in the circumferential direction, a processing means 21 which processes a plate surface of the semiconductor wafer which is rotated and driven, by using the processing solution, an acceleration sensor 13 which detects the notches 12 of the semiconductor wafer which is rotated and driven, and signal processing equipment 15 which decides whether the slip is generated in the rotation of the substrate, on the basis of detection of the acceleration sensor.
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