METHOD FOR MANUFACTURING SILICON WAFER AND SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To form BMDs inside a silicon wafer in a shorter time and by a lower temperature heat treatment than conventional. SOLUTION: This method for manufacturing the silicon wafer, where the silicon wafer is heat-treated in a gas atmosphere to form vacancies inside, is characterized in that the silicon wafer W, to which nitrogen is previously added, is subjected to the heat treatment.