| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sample chuck capable of realizing flatness, electric contact, lightweight, low contamination and cost reduction in holding a semiconductor sample. SOLUTION: The sample chuck 2 supporting the semiconductor sample 13 is provided with an upper side layer 6 formed of a semiconductor material and having a holding face 18 holding the sample, and a lower side layer 4 formed of a conductive material and laminated on the contrary side to the holding face of the upper side layer. The upper side layer 6 and the lower side layer 4 are coupled with a conductive binder 16.</p> |
