COMBINATION STRUCTURE OF ENCLOSURE AND HEATSINK, AND METHOD FOR FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a combination structure of an enclosure and heatsink for a semiconductor device. SOLUTION: A first mixture of metal powder, lubricant, and binder is prepared as a first material. A second mixture of metal powder, lubricant, and binder, in which the difference from the first material in sintered shrinkage is less than 1%, is prepared as a second material. The lubricants and binders are removed from the first and second raw components to form first and second powder skeletons. The first and second powder skeletons are sintered to complete the combination structure of enclosure and heatsink. The first and second powder skeletons tightly contact each other during sintering.