发明名称 HEATING APPARATUS OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a heating apparatus of a substrate that can uniformly heat the substrate at a high temperature. SOLUTION: A first planar section 3 that opposes one surface in a substrate 1 with an interval, and a side section 4 that surrounds the circumference section of the substrate 1 with an interval area set to be mirror surfaces 7. A heating vessel 2 is formed so as to accommodate the substrate 1 inside with a second planar section 5 that opposes the other surface of the substrate 1 at an interval as a transparent plate 5a having infrared transmission properties. A heater 8 is provided outside the transparent plate 5a of the heating vessel 2.
申请公布号 JP2003077831(A) 申请公布日期 2003.03.14
申请号 JP20010270652 申请日期 2001.09.06
申请人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD 发明人 OGUMA MASATO;MIZUNO MASAYUKI;YAMAGUCHI MASASHI;MIYOSHI KAZUO;KURODA YUKIO;TANAKA TAKAHIRO
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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