PHOTORESIST APPLICATION METHOD AND APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a photoresist application method. SOLUTION: The photoresist application method includes a stage for jetting a solvent against a wafer W, a stage for jetting photoresist against the wafer W, and a stage for rotating the wafer at a fixed speed in this order. The solvent is jetted against the surface of the wafer W before the photoresist is jetted, thus reducing the surface tension and the viscosity of resist, and hence uniformly applying the photoresist that is an organic solvent onto the surface of the wafer W.