| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive thermosetting resin composition excellent in heat resistance, chemical plating resistance, resolving power, etc., as a soldering resist. SOLUTION: The photosensitive thermosetting resin composition comprises (A) a photopolymerizable prepolymer (formula I) obtained by reacting an epoxy resin (A1) having two or more epoxy groups with a monocarboxylic acid (A2) having one vinyl group and further with a saturated or unsaturated polyvalent acid anhydride (A3), (B) a diluent selected from single or combined diluents of photopolymerizable vinyl monomers (B1) and/or organic solvents (B2), (C) a photopolymerization initiator, (D) an epoxy resin including a dissolvable crystalline epoxy resin (D1) which has two epoxy groups in one molecular unit and does not dissolve in the used diluent at room temperature but dissolves in the diluent at a temperature of 60-80 deg.C and/or an epoxy resin (D2) which has at least two epoxy groups in one molecular unit and dissolves in the used diluent at room temperature and (E) an inorganic filler. |
