发明名称 ELECTRON BEAM SYSTEM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a projection type electron beam system with which the moving direction of the stage and the integrated direction of the arrangement of TDI-CCD acceptance surface are matched with high degree of accuracy. SOLUTION: A sample 11 set on a stage 21 is irradiated with a plurality of primary electron beams emitted from an electron gun 1. With this set-up, secondary electrons are emitted from the sample, received by micro channel plate (MCP) 16 and are changed into an electrical signal within a TDI-CCD 19 via a scintillator 17 and a relay optical system 18. The electron beams going to MCP 16 are properly rotated by adjusting intensity of magnetic field from a magnetic lens 15, by which the moving direction of the stage and the integrated direction of the arrangement of the TDI-CCD acceptance surface are matched. The electric signal generated by the TDI-CCD is displayed after treatment in an image display section 20.</p>
申请公布号 JP2003077413(A) 申请公布日期 2003.03.14
申请号 JP20010270161 申请日期 2001.09.06
申请人 TOSHIBA CORP;EBARA CORP 发明人 NAGAHAMA ICHIROTA;YAMAZAKI YUICHIRO;SATAKE TORU;NOMICHI SHINJI
分类号 G01N23/225;G01R31/302;G01T1/20;G01T1/29;G21K1/093;G21K5/04;H01J37/141;H01J37/244;H01J37/28;H01J37/29;H01L21/66;(IPC1-7):H01J37/244 主分类号 G01N23/225
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