BONDING METHOD AND BONDING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a bonding method for accurately detecting a chip at a front-end position to bond all chips without fail. SOLUTION: The method which sequentially takes out multiple chips formed on a semiconductor wafer 5 and bonds them on a substrate 25 comprises steps of imaging a plurality of chips on the semiconductor wafer; recognizing the plurality of chips from the image acquired by the imaging step; determining whether the recognized plurality of chips have any defect thereon; picking up the chips for bonding on the substrate; and carrying the chips while controlling such that chips determined to have a defect based on the determining step are omitted before being carried.