ELECTRONIC-COMPONENT MOUNTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus by which the mounting efficiency of an electronic component onto a circuit board is enhanced, by a method wherein a plurality of kinds of electronic components including the electronic component incapable of being sucked and held by a conventional suction nozzle can be held by a single holding mechanism, without using a holding mechanism exclusively used for each electronic component. SOLUTION: A mounting head part 12 is provided with a holding mechanism 14 for relative movement. The holding mechanism 14 is provided with an adhesion body 15 which holds an electronic component 16 by adhesive force. At a component feed part 13, the adhesive body 15 is pressed to the electronic component 16 to hold it by adhesion.