发明名称 APPARATUS AND METHOD FOR COMPONENT MOUNTING
摘要 PROBLEM TO BE SOLVED: To provide a component mounting apparatus provided with a suction nozzle by which there is no fear that a component deviates or falls even when the component is moved at high speed, and to provide a component mounting method. SOLUTION: In the component mounting apparatus, the component is sucked to a suction-nozzle end, and the component is mounted by moving the suction nozzle to a component mounting position from a component feeding position. A shielding means is installed which shields an airflow hitting the component sucked by the suction nozzle when the suction nozzle is moved.
申请公布号 JP2003078292(A) 申请公布日期 2003.03.14
申请号 JP20010265925 申请日期 2001.09.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IMAFUKU SHIGEKI;YOSHITAKE TAKANORI
分类号 H05K13/04 主分类号 H05K13/04
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