| 摘要 |
PROBLEM TO BE SOLVED: To make frequency characteristics satisfactory. SOLUTION: A high frequency coaxial line composed of a dielectric 10 and a central conductor 11 is airtightly sealed on the side wall of a casing 1, a high frequency semiconductor device 3 is packaged in the casing 1, and the high frequency semiconductor device 3 is connected to the casing 1 with a bonding material 4. Then, a central conductor 7 and an external conductor of a coplanar line are formed on the high frequency semiconductor device 3, a central conductor 22 and the external conductor of the coplanar line are formed on the surface of a wiring board 21, and the central conductor 22 and the central conductor 7 are connected by a micro-bump 24. At the same time, the external conductor of the coplanar line formed on the high frequency semiconductor device 3, and the external conductor of the coplanar line formed on the surface of the wiring board, are connected by a micro-bump 24, the central conductor 11 and the central conductor 22 are connected, and an expanded part 25 is provided on the casing 1. Then, the expanded part 25 is connected with the external conductor of the coplanar line formed on the surface of the wiring board 21. |
