SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method capable of suppressing enlargement of a chip area while highly precisely performing dicing. SOLUTION: An inspection pad 3 connected to a circuit area 1 is formed of the circuit area 1 and a connection part 4 on a wafer 7. The inspection pad 3 comprises a plurality of metal layers, and a contact 5 connecting the metal layers is formed on only an edge part 3b being an area remote from the circuit area 1 in at least a pair of the opposite metal layers. When the wafer 7 is diced so as to separate the inspection pad 3 from the circuit area 1, the edge part 3b out of the inspection pad 3 is diced by using a dicing blade 21 having a removable blade width B.