| 摘要 |
The present invention relates to high-precision placement of optical components (110), such as semiconductor lasers, lenses and photodiodes on component carriers. A first positioning means (115) positions the optical component (110) within a first range of tolerance (R1) with respect to a perpendicular axis (A) from an intended position (P) on the component carrier (120). Then, at least one image representing the optical component (110) and a target area, which includes the intended position (P) are captured (150) and image processed (160). Based on the result of this processing, a second positioning means (140) fine positions the component carrier (120) with respect to the optical component's (110) position relative the axis (A), such that the optical component (110) and the intended position (P) on the component carrier (120) are aligned within a second range of tolerance (R2), which is more narrow than the first range of tolerance (R1). Finally, the first positioning means (115) places the optical component (110) on the component carrier (120). |
