DUST PARTICLE DETECTION METHOD, ITS DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the problem that minute dust particles exist during semiconductor manufacturing because LSI is made minute and contamination due to heavy metal elements or the like existing in a wafer or on the surface of the wafer can not be detected. SOLUTION: An atmosphere setting and holding system detected while suppressing Rayleigh scattering in which scattering light from the dust particles or the contamination is unnecessary in a specific atmosphere in a scattering light detection system is provided with a contamination detector for detecting scattering light detection from the dust particles existing on a substrate or contamination, and the contamination detector is provided with a substrate heating system for further previously heating the substrate prior to contamination detection. The above constituted contamination detector is installed in a doorway of each substrate of a vacuum processing device for semiconductor manufacturing.