| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic parts installing apparatus for allowing taking out electronic parts in a wafer state in an efficient manner to install them on a substrate, and a method of installing the electronic parts. SOLUTION: In the electronic parts installing apparatus which takes out semiconductor chips 12a from wafer holding units 10A and 10B which hold semiconductor wafers by a transfer head 5 provided with a plurality of absorption nozzles 6 for transfer to the substrate 2, taking out semiconductor chips 12 by the transfer head 5 on the wafer holding unit and imaging of semiconductor chips 12a to be taken out next time by a parts recognizing camera 9 on the other wafer holding unit are performed simultaneously and in parallel. This allows increasing the number of semiconductor chips to be taken out for every turn, and surely taking out the semiconductor chips 12a, of which positions are detected by imaging, without a pickup error due to displacement, thus making it possible to efficiently and surely install electronic part in wafer state to the substrate 2.
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