发明名称 |
INSPECTION DEVICE OF SEMICONDUCTOR CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To wholly flatten a bottom face height of a division type contact structure in an inspection device of a semiconductor circuit lifted and held in a state that a plurality of the division type contact structures are arranged so as to correspond to each semiconductor circuit on a wafer. SOLUTION: The inspection device having the plurality of the division type contact structures 5 provided with a contact part 10 contactable on the whole electrode pad 3 of each of a plurality of the semiconductor circuits manufactured on a lower face of the wafer 1 on a lower face of a base member 6, lifted and held on the base member 6 in the state that each of the plurality of the contact structures 5 is arranged so as to correspond to each semiconductor circuit and inspecting each semiconductor circuit, is provided with a means for adjusting the bottom face height of the contact structure 5 and wholly flattening each bottom face. Thereby the bottom face height of the contact structure 5 can be wholly flattened to perform a stable wafer burn-in test.
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申请公布号 |
JP2003077966(A) |
申请公布日期 |
2003.03.14 |
申请号 |
JP20010270369 |
申请日期 |
2001.09.06 |
申请人 |
HITACHI ELECTRONICS ENG CO LTD;HITACHI LTD |
发明人 |
SHOJI TERUO;HASEBE AKIO |
分类号 |
G01R31/26;G01R1/06;G01R31/02;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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