| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-molded board which enables parts to be well soldered to a metal frame without increasing its manufacturing cost. SOLUTION: A metal frame where an electric circuit pattern is formed is sealed up in a resin molded body for the formation of a resin-molded board 1. First openings 5 and 5' which uncover the metal frame 2 on the surface of a resin layer 3 located on the metal frame 2 which is formed in parallel with the direction of transfer when the resin-molded board 1 is soldered are provided besides a land opening 4 for soldering an electronic part, and a second opening 6 necessary for manufacturing the board 1 and positioning a metal frame 2. Therefore, heat that is released at soldering and conducted from the land opening 4 to the other land opening 4 through the metal frame 2 can be dissipated through the first openings 5 and 5', so that an soldering operation can be carried out at a proper heating temperature through the other land opening 4, and soldering failures can be prevented.
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