发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a capacitor having sufficient capacitance as a storage element even if a semiconductor device is reduced and the opening size of a groove in a storage element capacitor becomes small. SOLUTION: A conductive layer for preventing stepped cut constituted of polycrystalline silicon 43b is previously disposed on the base of a semispherical silicon 44b. Thus, a surface area multiplication factor 1.8 is secured and a stepped cut at a lower electrode can be avoided even if large semispherical silicon balls 44b are formed.
申请公布号 JP2003078028(A) 申请公布日期 2003.03.14
申请号 JP20010263538 申请日期 2001.08.31
申请人 HITACHI LTD;NEC CORP 发明人 IIJIMA SHINPEI;KAWAGOE TAKESHI;KITAMURA HIROYUKI
分类号 H01L21/8242;H01L27/108 主分类号 H01L21/8242
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