| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming an external connection electrode of a semiconductor device which can cope with the miniaturization and narrower pitch of a semiconductor device, and can be manufactured at lower cost, and a platy jig used for the same. SOLUTION: A method of forming an external connection electrodes of a semiconductor device having surface electrodes 4 which are formed on projections disposed on an installing surface of the semiconductor device comprises steps of extending a viscous material on a stage 6; bring surface electrodes 4 of the semiconductor device into contact with an extended viscous material 8 for transferring the viscous material 8 on the surface electrodes 7; causing the viscous material 8 which is transferred to the surface electrodes 4 to capture solder balls 10 by bringing the surface electrodes 4 on which viscous material 8 is transferred into contact with the solder balls which are spread in an entire tray 11 to be evenly disposed; and forming external connection electrodes 24 on the surface electrodes 4 by heating to melt the captured solder balls 10. |
