发明名称 COOLING HEAT-PIPE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a rational and economic cooling heat-pipe device in which a heat-pipe is skillfully utilized to suppress the height of a device to make it compact, resulting in very efficient heat radiation. SOLUTION: There are provided a square heat-receiving plate 3, a heat-pipe H which is almost U- or V-shaped and of which a concave middle part is fixed to the heat receiving plate 3, and a plurality of heat sinks 5, similar in shape to the heat receiving plate and fixed to both ends of the heat-pipe. The heatsinks 5 are stacked with a prescribed space, parallel to each other, with both ends of the heat-pipe penetrating the heatsinks 5.
申请公布号 JP2003078091(A) 申请公布日期 2003.03.14
申请号 JP20020227634 申请日期 2002.08.05
申请人 FUJITSU LTD 发明人 UEDA AKIRA;SUZUKI MASUMI
分类号 F28D15/02;H01L23/427 主分类号 F28D15/02
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