发明名称 ACOUSTIC MATCHING MEMBER
摘要 PROBLEM TO BE SOLVED: To reduce the density dispersion and sound output dispersion of an acoustic matching member matching acoustic impedance of an ultrasonic wave receiving/oscillating means with that of gas. SOLUTION: A main material for a thin film structure 11 is etched to form air gaps 12 and the acoustic matching member is configured by layering the thin film structures 11.
申请公布号 JP2003078996(A) 申请公布日期 2003.03.14
申请号 JP20010268456 申请日期 2001.09.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MOROZUMI HIDEKI;BETSUSOU DAISUKE;NAKABAYASHI YUJI
分类号 H04R17/00;(IPC1-7):H04R17/00 主分类号 H04R17/00
代理机构 代理人
主权项
地址