发明名称 |
ACOUSTIC MATCHING MEMBER |
摘要 |
PROBLEM TO BE SOLVED: To reduce the density dispersion and sound output dispersion of an acoustic matching member matching acoustic impedance of an ultrasonic wave receiving/oscillating means with that of gas. SOLUTION: A main material for a thin film structure 11 is etched to form air gaps 12 and the acoustic matching member is configured by layering the thin film structures 11.
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申请公布号 |
JP2003078996(A) |
申请公布日期 |
2003.03.14 |
申请号 |
JP20010268456 |
申请日期 |
2001.09.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MOROZUMI HIDEKI;BETSUSOU DAISUKE;NAKABAYASHI YUJI |
分类号 |
H04R17/00;(IPC1-7):H04R17/00 |
主分类号 |
H04R17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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