发明名称 WIRING BETWEEN ELEMENT
摘要 PROBLEM TO BE SOLVED: To form wiring between elements by using carbon nanotube, which, regardless of an ultra fine scale diameter of the order of nanometers (nm), has a structure where its length is not limited and has a very high mechanical strength, and which exhibits either metal or semiconductor electrical conductivity in response to structures and/or diameters. SOLUTION: The wiring between elements, which are connected electrically between two or more fine elements (2) formed on a substrate (4), in a state not to come in contact with the substrate (4), using carbon nanotube (1) in the shape to float and to be stretched. In addition, by forming an insulating layer on the substrate, the wiring between elements, which are connected electrically between two or more fine elements formed on the insulating layer, can be formed using carbon nanotube in the shape to creep on the insulating layer.
申请公布号 JP2003077923(A) 申请公布日期 2003.03.14
申请号 JP20010269834 申请日期 2001.09.06
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 HONMA YOSHIKAZU;OGINO TOSHIRO;KOBAYASHI YOSHIHIRO
分类号 H01L21/3205;H01L23/52;H01L23/538;(IPC1-7):H01L21/320 主分类号 H01L21/3205
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