| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board of high density wiring with which the transmission loss of a signal is almost eliminated and desired electric characteristics can be provided even when an electrode pad interval becomes small. SOLUTION: The wiring board is provided with a packaging part 7a for electronic components 7 provided in a prescribed area on the principal surface of an insulated substrate 1 configured by laminating a plurality of insulating layers 1b; a plurality of lines of electrode pads 4 arrayed almost at equal intervals corresponding to the connecting terminals of the electronic components 7 on the peripheral side inside the packaging part 7a; and lead wires 5 formed being attached from the packaging part 7a toward the peripheral side of the insulated substrate 1, connected to the respective electrode pads 4 and drawn from the electrode pads 4b on the central side of the packaging part 7a through the first line of electrode pads 4a arrayed on the most peripheral side. The lead wire 5 is drawn being connected from the electrode pads 4b on the central side of the packaging part 7a through a through conductor 3a to a wiring conductor 2a of the lower layer respectively between the adjacent lines of electrode pads 4 and in the outside area of the first line of electrode pads 4a. |
