| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer mounting method handling a thin semiconductor wafer and a cassette used for it. SOLUTION: The wafers W processed thin by finishing background processing are mounted on a support plate 20 in the state that reverses are upward in the cassette C1 and stored in multiple stages in the state that they are sucked and held. The wafers W are taken out to be sucked and held from upward (reverse side of wafer) by an edge ring-like arm 2 from the cassette C1 charged in a mounting device, and consistently handled in the state that the reverses of the wafers W are upward in transferring and mounting them to an alignment stage 4 and transferring and mounting them from the alignment stage 4 to a mounting table 6.</p> |
