发明名称 |
Electronic component with at least two semiconductor chips, and process for its production |
摘要 |
An electronic component includes two semiconductor chips on an intermediate carrier, which is provided on its underside with external contacts, which are located on a plane with first external contacts on a first active chip surface of the first semiconductor chip. A rear side of the first semiconductor chip faces an active chip surface of the second semiconductor chip. The invention additionally relates to a process for the production of the electronic component.
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申请公布号 |
US2003047760(A1) |
申请公布日期 |
2003.03.13 |
申请号 |
US20020232171 |
申请日期 |
2002.08.30 |
申请人 |
DAECHE FRANK;ZUHR BERNHARD |
发明人 |
DAECHE FRANK;ZUHR BERNHARD |
分类号 |
H01L25/065;(IPC1-7):H01L29/80 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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