REDUCTION OF ELECTROSTATIC CHARGE ON A SUBSTRATE DURING PECVD PROCESS
摘要
Provided herein is a method of reducing an electrostatic charge on a substrate during a plasma enhanced chemical vapor deposition process, comprising the step of depositing a conductive layer onto a top surface of a susceptor support plate disposed within a deposition chamber wherein the conductive layer dissipates the electrostatic charge on the bottom surface of the substrate during a plasma enhanced chemical vapor deposition process. Also provided are a method of depositing a thin film during a plasma enhanced chemical vapor deposition process using the methods disclosed herein and a conductive susceptor.
申请公布号
WO03021003(A1)
申请公布日期
2003.03.13
申请号
WO2002US23848
申请日期
2002.07.26
申请人
APPLIED MATERIALS, INC.
发明人
WON, TAE, KYUNG;CHOI, SOO, YOUNG;TAKEHARA, TAKAKO;HARSHBARGER, WILLIAM, R.