发明名称 |
Integrated circuit component encased in carrier material has contacts which are connected by channels through a thinned under layer |
摘要 |
An integrated circuit component (11) encased in carrier material has connections (12) in an upper surface of the carrier for each integrated circuit. This surface is then covered and the carrier thinned from below. Contact points in the lower face are directly connected to the connections by channels. |
申请公布号 |
DE10153176(A1) |
申请公布日期 |
2003.03.13 |
申请号 |
DE2001153176 |
申请日期 |
2001.10.27 |
申请人 |
SCHOTT GLAS |
发明人 |
VOS, MARKUS |
分类号 |
B81B7/00;H01L21/56;H01L21/68;H01L23/31;H01L23/48;H01L27/146;(IPC1-7):H01L23/31 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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