PRINTED CIRCUIT BOARD WITH ISOLATED METALLIC SUBSTRATE COMPRISING AN INTEGRATED COOLING SYSTEM

摘要

The invention relates to a board comprising a metallic substrate (10), at least one electrically-isolating layer (11), which is stuck to the metallic substrate (10), and electroconductive tracks (12) which can be used to interconnect electronic power components (24) and which are stuck to the electrically-isolating layer (11). Said metallic substrate (10) comprises heat transfer channels which incorporate conduits for a coolant, said conduits extending to the outside of the metallic substrate as far as an area for transferring heat to an external medium.