| 摘要 |
<p>What is disclosed is a no-rinse autodeposition process to dip-apply a metal part in an aqueous resin coating bath with an immersion time and, wherein the removal rate of the dipped part is kept equal or below drainage rate of mobile liquid portion, such that upon removal of the part, drip edge formation is formation in minimized and a DFT is maintained within acceptable tolerance levels.</p> |
