发明名称 Method for designing wiring connecting section and semiconductor device
摘要 First, an amount of a current flowing between a first wiring and a third wiring is estimated, and the number of stack vias required for connecting the first wiring and the third wiring is determined. Next, based on the number of stack vias, the number of virtual wirings for determining positions of the stack vias is determined. Thereafter, the virtual wirings are arranged in a forming region of the third wiring above the first wiring, for example, at an equal interval, and the stack vias are created in intersections of the first wiring and the virtual wirings. Thereafter, the virtual wirings are removed, and the third wiring is created. According to needs, a second wiring passing between the stack vias is created.
申请公布号 US2003051218(A1) 申请公布日期 2003.03.13
申请号 US20020097871 申请日期 2002.03.15
申请人 FUJITSU LIMITED 发明人 KUMAGAI KENJI
分类号 H01L21/82;G06F17/50;H01L23/522;(IPC1-7):G06F17/50;G06F9/45 主分类号 H01L21/82
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