| 摘要 |
<p>The invention relates to a package (2) for electronic components (8,10) comprising at least two substrates (4,6). Each substrate supports an electronic component (8,10). External connectors (34) provide external connection to the electronic components (8,10). A non-conductive frame (12) supports the at least two substrates (4,6) in a stacked arrangement, and the external connectors (34). Conductive lines (36,38) extend over the non-conductive frame (12) for electrically coupling the electronic components (8,10) to the external connectors (34).</p> |
