发明名称 Embedding resin and wiring substrate using the same
摘要 An embedding resin includes a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa.s in a shear rate of 8.4 s-1 after allowing to stand for 24 hours at 25° C.±1° C.
申请公布号 US2003047809(A1) 申请公布日期 2003.03.13
申请号 US20010026454 申请日期 2001.12.27
申请人 NGK SPARK PLUG CO., LTD. 发明人 TAKEUCHI HIROKI;KOJIMA TOSHIFUMI;OHBAYASHI KAZUSHIGE;KASHIMA HISAHITO
分类号 H01L21/56;H01L21/68;H01L23/498;H05K1/18;(IPC1-7):H01L23/495;H01L23/52;H01L29/40 主分类号 H01L21/56
代理机构 代理人
主权项
地址