| 摘要 |
A Temperature-sensing apparatus is mounted within a wafer chuck (7) to contact the underside surface of a wafer that is secured by the chuck. A sensing element (23) having a photoluminescent materiel thereon is mounted in resilient contact with the wafer and emits a luminous flux in response to radiant energy stimulation with a characteristic intensity that varies with time as a function of temperature. A remote optical analyzer (39) supplies pulses of the radiant energy and receives the luminous flux to determine the temperature of the sensing element when it is in contact with the wafer. An optical channel (38) guides the radiant energy from the photoluminescent material to the remote optical analyzer.
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