摘要 |
A mounting device (1) including a plurality of heads (3), each holding a chip (2), arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads (3) with calibration marks, first recognition means (10) fixed in a chip mounting position (A), and second recognition means (16) fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads (3) In mounting operation, the first recognition means (10) recognizes the positions of a substrate (4) and the calibration marks of the heads (3), whereas the second recognition means (16) recognizes the positions of chips (2) attracted on the heads (3). The heads are moved vertically to adjust plane to be recognized. The chip (2) and the substrate (4) are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.
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