发明名称 |
Composition and method for manufacturing integral resistors in printed circuit boards |
摘要 |
An electrically resistive foil comprising a resistive composite material including a conductive material and a non-conductive material alone or incorporated into a two layer foil material that includes a conductive metal layer and a layer of the resistive composite material. This invention also includes circuit boards comprising an insulative substrate and an integral resistor comprising the resistive composite material of this invention as well as methods for manufacturing printed circuit boards including integral resistors.
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申请公布号 |
US2003048172(A1) |
申请公布日期 |
2003.03.13 |
申请号 |
US20020267726 |
申请日期 |
2002.10.08 |
申请人 |
OAK-MITSUI |
发明人 |
MEIGS JONATHAN H.;CARBIN DEREK |
分类号 |
H01C17/06;H01C17/16;H05K1/16;H05K3/06;(IPC1-7):H01C1/012 |
主分类号 |
H01C17/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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