发明名称 Composition and method for manufacturing integral resistors in printed circuit boards
摘要 An electrically resistive foil comprising a resistive composite material including a conductive material and a non-conductive material alone or incorporated into a two layer foil material that includes a conductive metal layer and a layer of the resistive composite material. This invention also includes circuit boards comprising an insulative substrate and an integral resistor comprising the resistive composite material of this invention as well as methods for manufacturing printed circuit boards including integral resistors.
申请公布号 US2003048172(A1) 申请公布日期 2003.03.13
申请号 US20020267726 申请日期 2002.10.08
申请人 OAK-MITSUI 发明人 MEIGS JONATHAN H.;CARBIN DEREK
分类号 H01C17/06;H01C17/16;H05K1/16;H05K3/06;(IPC1-7):H01C1/012 主分类号 H01C17/06
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