发明名称 SHEET MATERIAL AND ITS USE IN CIRCUIT BOARDS
摘要 <p>A sheet comprising thermoplastic polymer (TP) (4) and short high tensile modulus fibers (3) , in which the concentration of TP (4) in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.</p>
申请公布号 WO2003022020(A2) 申请公布日期 2003.03.13
申请号 US2002027546 申请日期 2002.08.29
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