| 摘要 |
A method of manufacturing heat dissipation device is disclosed. The method comprises stamping copper plates or boards of appropriate thickness to form heat dissipation seat and heat dissipation fins of appropriate shape; surface-furnishing of heat dissipation seat; surface oil-contaminant cleaning and treatment of the heat dissipation seat and heat dissipation fins under a protective gas; soldering with silver in an oven by coating the region between the heat dissipation seat and heat dissipation fins with a silver solder; performing an anti-oxidant process for copper on the heat dissipation seat and heat dissipation fins from the oven; and riveting or mounting a top cover for fixing a fan onto the heat dissipation seat.
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