| 摘要 |
PROBLEM TO BE SOLVED: To provide a suitable means for removing a deposited film without damaging holders, when cleaning the holders of a thin-film forming apparatus. SOLUTION: The method for removing the deposited film in cleaning the holders of the thin-film forming apparatus for manufacturing such as semiconductors or optical instruments, is characterized by a means of rapidly cooling the holders on which the film is deposited, through spraying liquid nitrogen to it, for making the deposited film to be crack-peeled because of the difference in thermal conductivity and/or heat expansion coefficient between the deposited film and the holders, and by a blast cleaning means of spraying fine particles of dry ice together with a compressed air to the above holders, on which residue of the deposited film remains.
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