| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive composition and an adhesive film which are used for mounting a semiconductor on a wiring board or a flexible board, contains no harmful substances such as a halogen and antimony and having excellent flame retardancy, and to provide a wiring board made of the adhesive film for mounting the semiconductor and a semiconductor device where the semiconductor is bonded to the wiring board using the adhesive film. SOLUTION: The flame-retardant adhesive composition comprises (a) 100 pts.wt. of an epoxy resin and a curing agent, (b) 20-500 pts.wt. of a polymeric compound having a weight-average molecular weight of at least 10,000 and at most 2,000,000, (c) at least 10 pts.wt. and at most 100 pts.wt., based on 100 pts.wt. of the total of the components (a) and (b) of particles of a hydrated metal compound, and (d) at least 2 pts.wt. and at most 30 pts.wt. of red phosphorus or a coated red phosphorus particle.</p> |
