发明名称 Tape processing device
摘要 <p>A tape processing device comprises a feed device for feeding a tape (T) having a layer of an adhesive; a cutter assembly (23) for cutting said tape (T), said cutter assembly having at least one cutting blade; and a coating device (25) for providing a coating of an adhesion-preventing liquid on said at least one cutting blade of said cutter assembly (23) to thereby prevent said tape (T) and said adhesive of said tape (T) from adhering to said at least one cutting blade of said cutter assembly (23). The tape (T) has an electrostatic property and is received within a casing and said cutter assembly (23) is provided with a static eliminator brush (24) which is brought into contact with said tape (T) in a position facing said cutter assembly (23), and at the same time grounded, for thereby eliminating static electricity charged on said tape (T). <IMAGE></p>
申请公布号 EP0841182(B1) 申请公布日期 2003.03.12
申请号 EP19970119455 申请日期 1997.11.06
申请人 SEIKO EPSON CORPORATION;KING JIM CO., LTD. 发明人 HASHIMOTO, AKIRA;FURUYA, YOSHIKIYO;TSUKUDA, HIDEYUKI;WATANABE, KENJI;KAMEDA, TAKANOBU;SHIMMURA, TOMOYUKI;MORIYA, TOMOHIRO;IIDA, HIRONAGA;ETO, YOUKO
分类号 B26D1/00;B26D1/30;B26D7/08;B41J11/70;(IPC1-7):B41J11/70 主分类号 B26D1/00
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