摘要 |
PURPOSE: An edge ring for a rapid thermal process apparatus is provided to minimize a contact area between a wafer and an edge ring and maintain uniform temperature of the wafer by forming a linear contact area between an upper portion of the edge ring and the wafer. CONSTITUTION: An upper end portion(110) of an edge ring(100) is used for loading a wafer. A contact part between the upper portion(110) and the wafer has a linear shape. An incline portion(120) is used for preventing break of the edge ring(100) due to a thermal shift phenomenon. A lower portion of the edge ring(100) is formed with a cylindrical rib(130). The lower portion of the edge ring(100) is inserted into a groove of a support body.
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