发明名称 DEVICE AND METHOD FOR INSPECTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To solve a problem that an erroneous detection rate for a tear-off condition of an ACF is difficult to be reduced while narrowing a pitch of a lead and saving a space thereof, in tear-off inspection in the ACF using a transmission type sensor or a reflection type sensor. SOLUTION: A substrate 1 bonded with the ACF 3 is image-picked up by a video camera 6, and an obtained image is binalized in an image processing part 7. The number of white picture elements or black picture elements of a binalized image therein is counted by a counting part 10, and a counted value therein is compared with a threshold value held preliminarily in a threshold value holding part 12 by a comparison circuit 11, so as to determined normality of an ACF-bonded condition or abnormality in which the ACF is torn off.
申请公布号 JP2003075366(A) 申请公布日期 2003.03.12
申请号 JP20010266922 申请日期 2001.09.04
申请人 SHIBAURA MECHATRONICS CORP 发明人 ITO KENICHI
分类号 G01N21/956;G02F1/13;G09F9/00;(IPC1-7):G01N21/956 主分类号 G01N21/956
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