| 摘要 |
PROBLEM TO BE SOLVED: To provide a fatigue tester for a wire bond junction part capable of controlling a carried current to stabilize a temperature difference between a current-carrying time and a current-carrying stop time of a power semiconductor and a current-carrying period thereto. SOLUTION: A current is periodically carried from a power drive part 12 to an IGBT element disposed in a thermostatic chamber 10, and the temperature of the IGBT element is recorded by a recorder 14 and monitored by a temperature monitor 16. The monitoring output of the temperature monitor 16 is fed back to the drive part 12 and the current is controlled by a current control circuit 18 provided for the drive part 12. In the control circuit 18, the carried current is so controlled as to stabilize the temperature difference between the current-carrying time and the current-carrying stop time of the IGBT element and the current-carrying period thereto.
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