| 摘要 |
PROBLEM TO BE SOLVED: To form a uniform thickness electrode excellent in durability on a ceramic substrate. SOLUTION: After a lower metallic thin film 16a comprising nickel is formed on the surface of a ceramic substrate 11 in a first prescribed film thickness, an upper gold thin film 16b is formed on the above film 16a in a second film thickness and then, an unnecessary portion 17 exclusive of an electrode portion 13 is deleted by a wafer saw 30. In this case, the first film thickness is controlled to be 0.3-1.0μm so as to fully cover the surface of the ceramic substrate without unevenness, the second film thickness to be 0.3-1.0μm to be able to function as the electrode, and the sum of the first and second film thicknesses is regulated to be 1.5μm or below.
|
